Bostik has extended its Born2Bond™ engineering adhesive HMPUR and UV-CIPG ranges to support the manufacture of smaller, more lightweight and increasingly complex consumer electronic devices that are also required to be recyclable and meet all relevant sustainability and safety regulations.
Six new products have been added to Born2Bond™'s high-performance HMPUR (Hot Melt Polyurethane Reactive) range to deliver precision, durability and speed of application. The range is flexible and elastic, delivers high bonding strength on multiple substrates, including plastic, glass and metal, and is available in multiple viscosities.
The UV-CIPG (UV Cure-In-Place Gaskets) range has been extended with two additional products to provide serviceable gasketing solutions that help to protect consumer electronics from dust and liquids. The new solutions provide greater design flexibility without the need to create new moulds required for traditional gaskets. They also deliver on durability with thermal and humidity resistance and change colour during the curing process.
Stephen Edwards, Business Director APAC of Engineering Adhesives at Bostik, says the business is focused on the needs of consumer electronics designers and manufacturers in the development of all new adhesives: “We extended the UV-CIPG range because we felt for too long the consumer electronics industry have felt the significant drawbacks of traditional gasketing solutions such as low performance and high production costs. Our Born2Bond™ engineering adhesives are delivering high-performance solutions to these challenges, as well as providing manufacturers with more adaptable and faster processes.”
For more information on Born2Bond™ product range and to request a sample of any of the products, visit the website.
